TG Unit Of CII To Host Meet On Packaging Innovations
CII Telangana committee members unveiling the poster of Telangana PackCon 2024, in Hyderabad on Monday
Hyderabad: Confederation of Indian Industry (CII) Telangana said it is organising the fourth edition of CII Telangana PackCon 2024, a two-day summit on future-ready packaging, on December 12 and 13, 2024, in city.
With the theme, “Innovating today for tomorrow’s global market challenges,” the summit will have networking, knowledge sharing, and sessions highlighting innovative packaging technologies and strategies.
Over 200 conference delegates, 60 speakers, 20 exhibitors, and 120 companies, will be participating. On day-one, the summit will focus on innovation and growth in packaging, advances in materials science, development of eco-friendly, biodegradable, and recyclable packaging solutions for addressing the environmental impact of traditional packaging. During the second day of the summit, the focus will be on sustainability and authenticity in packaging.
Besides a CEO/CXO roundtable session, the other sessions lined up includes, trends in Pharmaceutical packaging and emerging regulations, applications of AI, ML, and IoT in packaging, advancements in packaging machinery, global perspectives on packaging, combating counterfeit products, sustainable packaging for a circular economy, industrial and bulk packaging innovations.
